[Under construction]2015 AFOSR MURIAtomically-Thin Systems that Unfold, Interact and Communicate at the Cellular ScalePO: Dr. Harold Weinstock, Quantum Electronic SolidsPI: Jiwoong Park, Cornell UniversityWebsite:
The objective of this program is the development, control and application of atomically thin, membrane-like integrated circuits and devices, which can fold, unfold, interact and communicate at the cellular/subcellular scale. Such ultrathin, substrate-free circuits will be over a 1,000 times more flexible and bendable than current flexible electronics, enabling folded, 3D structures with nanoscale features with previously unexplored mechanical, physical and surface properties. These novel properties offer revolutionary applications in health, biology, and remote and dispersable sensing with significant DoD relevance; examples include “wearable” and foldable electronics at the cellular and subcellular level, microscopic deployable structures whose surface area can increase by several orders of magnitude upon actuation, and aeroplankton-like deployable sensors that are aerosolized and dispersed in microscopic droplets.
In order to pursue these goals, our MURI team will explore and solve fundamental scientific and engineering challenges in the fabrication, transformation, communication and integration/deployment of systems constructed from atomically-thin, flexible, substrate-free films of 2D layered materials (2DLMs). We will generate wafer-scale 2DLM building blocks (metal, insulator and semiconductors) and develop lateral stitching and vertical stacking methods to produce 2DLM-based integrated circuits and devices in large quantities. We will develop a suite of general schemes, including Kirigami, optical & magnetic actuations and surface-induced self-folding, to reversibly and controllably bend and fold 2DLM structures into pre-programmed 3D structures at micron and nanometer length scales. We will develop detection and remotecontrol mechanisms for 2D and 3D 2DLM structures, by exploring their RF, optical and photothermal responses. Finally, we will work for systems integration, deployment and the applications enabled by this new generation of ultrathin 2DLM-based integrated circuits.
The proposed research activities are highly synergistic and leverages interdisciplinary strengths provided by six world-leading scientists and engineers from three universities and three collaborators from two DoD laboratories. Our research will also make a significant impact on both fundamental science and applied technology in multiple disciplines, including 2D materials and devices; integrated nanoelectronics; nanomechanics and 2D kirigami; 2D to 3D selffolding/actuation; nanocharacterization/imaging; flexible electronics and optical metamaterials.